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Low Temperature Joining and High Temperature Application of Segmented Half Heusler/Skutterudite Thermoelectric Joints
Wang, WA; Li, XY; Gu, M; Xing, YF; Bao, YF
2020
Source PublicationMATERIALS
Issue1
SubtypeArticle
AbstractA low temperature joining process has been developed to fabricate segmented half Heusler/skutterudite thermoelectric joints, and high temperature service behavior of the joints has been studied. The microstructure and electrical resistance across the joint before and after aging were investigated. The joint is well bonded and no cracks appear at the interfaces of the joint before and after aging, which can attribute to the formation of high melting point intermetallic compounds. The electrical resistance crosses the bonding layer smoothly and the contact resistance is low. These results show the process is effective, and promising for preparation of segmented thermoelectric devices.
DOI10.3390/ma13010155
WOS KeywordPOWER-GENERATION ; MICROSTRUCTURAL EVOLUTION ; NANOCOMPOSITES ; FABRICATION ; EFFICIENCY ; PROGRESS ; DEVICES
Language英语
WOS Research AreaMaterials Science
PublisherMDPI
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/28392
Collection中国科学院上海硅酸盐研究所
Recommended Citation
GB/T 7714
Wang, WA,Li, XY,Gu, M,et al. Low Temperature Joining and High Temperature Application of Segmented Half Heusler/Skutterudite Thermoelectric Joints[J]. MATERIALS,2020(1).
APA Wang, WA,Li, XY,Gu, M,Xing, YF,&Bao, YF.(2020).Low Temperature Joining and High Temperature Application of Segmented Half Heusler/Skutterudite Thermoelectric Joints.MATERIALS(1).
MLA Wang, WA,et al."Low Temperature Joining and High Temperature Application of Segmented Half Heusler/Skutterudite Thermoelectric Joints".MATERIALS .1(2020).
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