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Mechanisms of ductile mode machining for AlON ceramics
Zhang, CY; Liu, H; Zhao, QL; Guo, B; Wang, JH; Zhang, J
2020-02-01
Source PublicationCERAMICS INTERNATIONAL
ISSN0272-8842
Issue2Pages:1844
SubtypeArticle
AbstractThis paper aims to reveal the mechanisms of ductile mode machining for AlON ceramics. The removal characteristics during machining were studied through ultra-precision grinding experiments. The machined surface consists of fractured and smooth areas, which were generated by brittle and ductile removal, respectively, of the individual AlON grains. The material removal mode has a determining effect on the surface/subsurface quality. The proportion of the fractured areas on the ground surface decreased gradually with a decrease in the depth of cut. The crystal indices of the grains most prone to brittle removal on the workpiece surface were determined using micro-area X-ray diffraction (mu XRD) analysis performed using a beam with 50 mu m diameter. The results showed that the ductile removal of the {111} planes is critical for the ductile mode machining of AlON. Nanoindentation tests based on electron back-scattered diffraction (EBSD) indicated that AlON shows strong anisotropy in its mechanical properties and machinability. The (111) plane has the highest hardness and lowest fracture toughness, at 22.91 GPa and 1.8 MPa m(1/2), respectively. The material removal mechanism during the grinding of AlON was discussed in detail. The minimum and maximum d(c(hkl)) values must be known for classifying whether the removal mode of the workpiece is brittle or ductile. A damage-free surface could be obtained during ductile mode grinding by controlling h(max) to be less than d(c(111)). The subsurface deformation mechanism during ductile mode grinding was analysed. An amorphous layer was observed close to the ground surface. Further, dense dislocations with no particular orientation were present beneath this amorphous layer. As the crystal structure became clearer with an increase in the depth, the plastic deformation shifted to stacking faults parallel to the {111} planes.
DOI10.1016/j.ceramint.2019.09.161
WOS KeywordMATERIAL REMOVAL ; SURFACE/SUBSURFACE DAMAGE ; SURFACE QUALITY ; SILICON-CARBIDE ; SINGLE-CRYSTAL ; FRACTURE ; SPEED ; DENSIFICATION ; TRANSITION ; PARAMETERS
Language英语
WOS Research AreaMaterials Science
PublisherELSEVIER SCI LTD
Citation statistics
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/28325
Collection中国科学院上海硅酸盐研究所
Recommended Citation
GB/T 7714
Zhang, CY,Liu, H,Zhao, QL,et al. Mechanisms of ductile mode machining for AlON ceramics[J]. CERAMICS INTERNATIONAL,2020(2):1844.
APA Zhang, CY,Liu, H,Zhao, QL,Guo, B,Wang, JH,&Zhang, J.(2020).Mechanisms of ductile mode machining for AlON ceramics.CERAMICS INTERNATIONAL(2),1844.
MLA Zhang, CY,et al."Mechanisms of ductile mode machining for AlON ceramics".CERAMICS INTERNATIONAL .2(2020):1844.
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