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Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification
Zhao, WQ; Lin, PP; Lin, TS; He, P; Liu, Y; Long, WM; Li, J
2020-10-01
Source PublicationJOURNAL OF MANUFACTURING PROCESSES
ISSN1526-6125
Pages1034
SubtypeArticle
AbstractOwing to the isothermal solidification of eutectic Au-Si filler, NiTi joint that could endure 700 degrees C has been successfully manufactured at 430 degrees C for the first time. The joining temperauture is within the aging temperature range, which is harmless to the properties of the NiTi base metal. A total consumption of the eutectic Si leaves a seam full of Au, whiskers and nanocrystalline layers due to the reaction of Si and NiTi. With the high-density stacking faults, the nanocrystalline layers at the interface exhibits ultra-high mechanical property, which strengthen the interfaces.
DOI10.1016/j.jmapro.2020.09.007
Language英语
WOS Research AreaEngineering
PublisherELSEVIER SCI LTD
Citation statistics
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/27704
Collection中国科学院上海硅酸盐研究所
Recommended Citation
GB/T 7714
Zhao, WQ,Lin, PP,Lin, TS,et al. Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification[J]. JOURNAL OF MANUFACTURING PROCESSES,2020:1034.
APA Zhao, WQ.,Lin, PP.,Lin, TS.,He, P.,Liu, Y.,...&Li, J.(2020).Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification.JOURNAL OF MANUFACTURING PROCESSES,1034.
MLA Zhao, WQ,et al."Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification".JOURNAL OF MANUFACTURING PROCESSES (2020):1034.
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