KMS Shanghai Institute of Ceramics，Chinese Academy of Sciences
| Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification | |
| Zhao, WQ; Lin, PP; Lin, TS; He, P; Liu, Y; Long, WM; Li, J | |
| 2020-10-01 | |
| Source Publication | JOURNAL OF MANUFACTURING PROCESSES
 |
| ISSN | 1526-6125 |
| Pages | 1034 |
| Subtype | Article |
| Abstract | Owing to the isothermal solidification of eutectic Au-Si filler, NiTi joint that could endure 700 degrees C has been successfully manufactured at 430 degrees C for the first time. The joining temperauture is within the aging temperature range, which is harmless to the properties of the NiTi base metal. A total consumption of the eutectic Si leaves a seam full of Au, whiskers and nanocrystalline layers due to the reaction of Si and NiTi. With the high-density stacking faults, the nanocrystalline layers at the interface exhibits ultra-high mechanical property, which strengthen the interfaces. |
| DOI | 10.1016/j.jmapro.2020.09.007 |
| Language | 英语 |
| WOS Research Area | Engineering |
| Publisher | ELSEVIER SCI LTD |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.sic.ac.cn/handle/331005/27704 |
| Collection | 中国科学院上海硅酸盐研究所 |
| Recommended Citation GB/T 7714 | Zhao, WQ,Lin, PP,Lin, TS,et al. Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification[J]. JOURNAL OF MANUFACTURING PROCESSES,2020:1034. |
| APA | Zhao, WQ.,Lin, PP.,Lin, TS.,He, P.,Liu, Y.,...&Li, J.(2020).Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification.JOURNAL OF MANUFACTURING PROCESSES,1034. |
| MLA | Zhao, WQ,et al."Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification".JOURNAL OF MANUFACTURING PROCESSES (2020):1034. |
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