Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling

doi:10.1016/j.matlet.2020.128598

SIC OpenIR

	Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling
	Li, GS; Wang, CH; Zhang, HY; Zhuang, MX; Hu, ZC; Liu, Y; Wang, L
	2020-12-01
Source Publication	MATERIALS LETTERS
ISSN	0167-577X
Subtype	Article
Abstract	In this study, a novel AlN-Al composite coating (AACC) is proposed for micro-electronic packaging. By adjusting the proportion of AlN in the AACC, the effective thermal conductivity and coefficient of thermal expansion of the AACC can be controlled. The powder of AlN and Al sprayed onto the surface of the W-Cu alloy to form the AACC that acts as a buffer layer to reduce the thermal mismatch between the W-Cu alloy and microchip. Finite element simulation results show that the thermal conductivity decreases from 240.64 to 179.99 W m(-1) K-1 with increasing AlN content. The coefficient of thermal expansion ranges from 8.39 to 205 MPa in the case of a selected W-Cu alloy (W70-Cu30). Some microscopic features that affect the thermal conductivity of the coating, such as porosity, pore shape, and pore orientation, have been investigated. Macroscopic properties from an SEM image of real microstructures were studied using the Object-oriented finite element (OOF) analysis. (C) 2020 Elsevier B.V. All rights reserved.
DOI	10.1016/j.matlet.2020.128598
WOS Keyword	THERMAL BARRIER COATINGS ; CONDUCTIVITY
Language	英语
WOS Research Area	Materials Science ; Physics
Publisher	ELSEVIER
Citation statistics
Document Type	期刊论文
Identifier	http://ir.sic.ac.cn/handle/331005/27593
Collection	中国科学院上海硅酸盐研究所
Recommended Citation GB/T 7714	Li, GS,Wang, CH,Zhang, HY,et al. Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling[J]. MATERIALS LETTERS,2020.
APA	Li, GS.,Wang, CH.,Zhang, HY.,Zhuang, MX.,Hu, ZC.,...&Wang, L.(2020).Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling.MATERIALS LETTERS.
MLA	Li, GS,et al."Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling".MATERIALS LETTERS (2020).

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