SIC OpenIR
Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling
Li, GS; Wang, CH; Zhang, HY; Zhuang, MX; Hu, ZC; Liu, Y; Wang, L
2020-12-01
Source PublicationMATERIALS LETTERS
ISSN0167-577X
SubtypeArticle
AbstractIn this study, a novel AlN-Al composite coating (AACC) is proposed for micro-electronic packaging. By adjusting the proportion of AlN in the AACC, the effective thermal conductivity and coefficient of thermal expansion of the AACC can be controlled. The powder of AlN and Al sprayed onto the surface of the W-Cu alloy to form the AACC that acts as a buffer layer to reduce the thermal mismatch between the W-Cu alloy and microchip. Finite element simulation results show that the thermal conductivity decreases from 240.64 to 179.99 W m(-1) K-1 with increasing AlN content. The coefficient of thermal expansion ranges from 8.39 to 205 MPa in the case of a selected W-Cu alloy (W70-Cu30). Some microscopic features that affect the thermal conductivity of the coating, such as porosity, pore shape, and pore orientation, have been investigated. Macroscopic properties from an SEM image of real microstructures were studied using the Object-oriented finite element (OOF) analysis. (C) 2020 Elsevier B.V. All rights reserved.
DOI10.1016/j.matlet.2020.128598
WOS KeywordTHERMAL BARRIER COATINGS ; CONDUCTIVITY
Language英语
WOS Research AreaMaterials Science ; Physics
PublisherELSEVIER
Citation statistics
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/27593
Collection中国科学院上海硅酸盐研究所
Recommended Citation
GB/T 7714
Li, GS,Wang, CH,Zhang, HY,et al. Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling[J]. MATERIALS LETTERS,2020.
APA Li, GS.,Wang, CH.,Zhang, HY.,Zhuang, MX.,Hu, ZC.,...&Wang, L.(2020).Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling.MATERIALS LETTERS.
MLA Li, GS,et al."Preliminary design of a novel AlN-Al composite coating used for micro-electronic packaging via finite element modeling".MATERIALS LETTERS (2020).
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Li, GS]'s Articles
[Wang, CH]'s Articles
[Zhang, HY]'s Articles
Baidu academic
Similar articles in Baidu academic
[Li, GS]'s Articles
[Wang, CH]'s Articles
[Zhang, HY]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Li, GS]'s Articles
[Wang, CH]'s Articles
[Zhang, HY]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.