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The preparation of SiCP/Ag-Cu-Ti hybrid tapes and application in the joining of silicon carbide ceramics
Liu, Yan; Tang, Mao; Lin, Tiesong; Wu, Xishi; Zhang, Hui
2019-12-31
Source PublicationJOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
ISSN0169-4243
SubtypeArticle; Early Access
AbstractA novel method of tape casting to fabricate ceramic-particulate-reinforced composite filler alloy tapes with low organics (no more than 6 wt.%) was developed, with which SiCP/Ag-Cu-Ti hybrid tapes were successfully prepared and used in joining of sintered silicon carbide ceramics. The stress rheometer, scanning electron microscopy and energy dispersive spectrometer were used to characterize the rheological properties of slurry and microstructure of green tapes and joints. The slurry for tape casting consists of dispersant, binder, solvent, a mixture of ceramics particulates and metal powders, and no plasticizer was added. Castor oil phosphate was proven the suitable dispersant for the slurry, and the content of dispersant, binder, solid loading was optimized as 3 wt.%, 2.6 wt.% and 26 vol.%, respectively. The fabricated hybrid tapes possess good ductility and uniform thickness. The SiC particulates were homogeneously distributed in the metal powders matrix in both sides of the green tapes, and the distribution was retained in the SiC/SiC joints.
KeywordComposite filler alloy tape casting rheological properties preparation joining
DOI10.1080/01694243.2019.1690773
WOS KeywordFILLER ALLOY ; COMPOSITE ; SI3N4 ; STEEL
Language英语
WOS Research AreaEngineering ; Materials Science ; Mechanics
PublisherTAYLOR & FRANCIS LTD
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/27490
Collection中国科学院上海硅酸盐研究所
Recommended Citation
GB/T 7714
Liu, Yan,Tang, Mao,Lin, Tiesong,et al. The preparation of SiCP/Ag-Cu-Ti hybrid tapes and application in the joining of silicon carbide ceramics[J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY,2019.
APA Liu, Yan,Tang, Mao,Lin, Tiesong,Wu, Xishi,&Zhang, Hui.(2019).The preparation of SiCP/Ag-Cu-Ti hybrid tapes and application in the joining of silicon carbide ceramics.JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY.
MLA Liu, Yan,et al."The preparation of SiCP/Ag-Cu-Ti hybrid tapes and application in the joining of silicon carbide ceramics".JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY (2019).
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