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Low-firing and microwave dielectric properties of a novel glass-free MoO3-based dielectric ceramic for LTCC applications
Shu, Guojin; Yang, Fan; Hao, Liang; Zhang, Qiao; Meng, Fancheng; Lin, Huixing
2019-04-01
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume30Issue:8Pages:7485
SubtypeArticle
AbstractA novel glass-free MoO3-based dielectric ceramic of Li2Ni2(MoO4)(3) was prepared by the conventional solid-state route. The phase compositions, microstructures and microwave dielectric properties were investigated. The XRD data analysis shown that Li2Ni2(MoO4)(3) belongs to an orthorhmbic lyonsite-type structure with Pmcn (62) space group during the sintering temperature range from 650 to 725 degrees C. The Li2Ni2(MoO4)(3) ceramic could be well densification at 700 degrees C for 2h with 96.8% relative density and exhibited excellent microwave dielectric properties: epsilon(r)=9.2, Qxf=41,064GHz, (f) =-68.86ppm/degrees C. Moreover, the Li2Ni2(MoO4)(3) ceramic shown excellent compatible with Ag electrode, which makes it a promising candidate for advanced substrate materials in low temperature co-fired ceramic applications.
DOI10.1007/s10854-019-01061-1
Language英语
WOS Research AreaEngineering ; Materials Science ; Physics
PublisherSPRINGER
Citation statistics
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/27213
Collection中国科学院上海硅酸盐研究所
Recommended Citation
GB/T 7714
Shu, Guojin,Yang, Fan,Hao, Liang,et al. Low-firing and microwave dielectric properties of a novel glass-free MoO3-based dielectric ceramic for LTCC applications[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(8):7485.
APA Shu, Guojin,Yang, Fan,Hao, Liang,Zhang, Qiao,Meng, Fancheng,&Lin, Huixing.(2019).Low-firing and microwave dielectric properties of a novel glass-free MoO3-based dielectric ceramic for LTCC applications.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(8),7485.
MLA Shu, Guojin,et al."Low-firing and microwave dielectric properties of a novel glass-free MoO3-based dielectric ceramic for LTCC applications".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.8(2019):7485.
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