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Mechanical strength enhancement of low temperature co-fired multilayer ceramic substrates by introducing residual stress
Qian, Suxiang; Liu, Feng; Ma, Mingsheng; Chen, Guanyu; Liu, Zhifu; Li, Yongxiang
2019-06-01
Source PublicationCERAMICS INTERNATIONAL
ISSN0272-8842
Volume45Issue:8Pages:10982
SubtypeArticle
AbstractTwo low temperature cofirable ceramic materials with thermal expansion coefficients (TEC) of 5.9 ppm/K and 6.6 ppm/K, respectively, were used in this work to introduce residual stress by the multilayer cofiring process. Theoretical calculation and finite element method (FEM) simulation were used to optimize the multilayered ceramic substrate composition design to obtain enhanced mechanical performance. Based on the failure condition of materials, the multilayered ceramic substrate has an optimal thickness ratio of the surface layers to the whole laminate (sandwich structure). Indentation method was used to measure the surface residual stresses and 3-point bending tests were used to measure the mechanical strength. Enhanced mechanical strength of 404 MPa can be obtained when the thickness ratio of surface layer to the whole laminate is 0.19.
KeywordLTCC substrate Mechanical strength Residual stress Finite element analysis
DOI10.1016/j.ceramint.2019.02.181
Language英语
WOS Research AreaMaterials Science
PublisherELSEVIER SCI LTD
Citation statistics
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/27093
Collection中国科学院上海硅酸盐研究所
Recommended Citation
GB/T 7714
Qian, Suxiang,Liu, Feng,Ma, Mingsheng,et al. Mechanical strength enhancement of low temperature co-fired multilayer ceramic substrates by introducing residual stress[J]. CERAMICS INTERNATIONAL,2019,45(8):10982.
APA Qian, Suxiang,Liu, Feng,Ma, Mingsheng,Chen, Guanyu,Liu, Zhifu,&Li, Yongxiang.(2019).Mechanical strength enhancement of low temperature co-fired multilayer ceramic substrates by introducing residual stress.CERAMICS INTERNATIONAL,45(8),10982.
MLA Qian, Suxiang,et al."Mechanical strength enhancement of low temperature co-fired multilayer ceramic substrates by introducing residual stress".CERAMICS INTERNATIONAL 45.8(2019):10982.
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