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Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding
Wu, Xishi; Pei, Bingbing; Zhu, Yunzhou; Huang, Zhengren
2019-09-01
Source PublicationMATERIALS CHARACTERIZATION
ISSN1044-5803
Volume155
SubtypeArticle
AbstractAn improved joining technique by reaction bonded technology was studied. The final densification and joining of the reaction-sintered composites were simultaneously completed in the reaction bonding process by one-step Si infiltration process. This method achieves joints with strong interfacial bonding and high flexural strength. The joint obtained by the one-step silicon infiltration reaction has a more uniform microstructure, the joint flexural strength is increased to 203 MPa, and retention rate of the flexural strength is 96%, which is comparable to the flexural strength of the C-f/SiC substrate. The microstructure and interfacial evolution mechanism of the interlayer were discussed. The results show that a transition layer of 2-3 mu m transition layer formed between the interlayer and the C-f/SiC substrate, which is composed of SiC crystal grains of about 0.5-1 mu m. The formation of the transition layer is due to the carbon concentration difference at the interface between interlayer and substrate, resulting in the diffusion of carbon during the Si-C reaction.
KeywordC-f/SiC Reaction bonding Joint One-step Si infiltration
DOI10.1016/j.matchar.2019.109799
Language英语
WOS Research AreaMaterials Science ; Metallurgy & Metallurgical Engineering
PublisherELSEVIER SCIENCE INC
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/26870
Collection中国科学院上海硅酸盐研究所
Recommended Citation
GB/T 7714
Wu, Xishi,Pei, Bingbing,Zhu, Yunzhou,et al. Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding[J]. MATERIALS CHARACTERIZATION,2019,155.
APA Wu, Xishi,Pei, Bingbing,Zhu, Yunzhou,&Huang, Zhengren.(2019).Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding.MATERIALS CHARACTERIZATION,155.
MLA Wu, Xishi,et al."Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding".MATERIALS CHARACTERIZATION 155(2019).
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