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Enhanced Thermoelectric Performance through Tuning Bonding Energy in Cu2Se1-xSxLiquid-like Materials
Zhao, Kunpeng1,2; Blichfeld, Anders Bank3,4; Chen, Hongyi1,2; Song, Qingfeng1,2; Zhang, Tiansong1; Zhu, Chenxi1,2; Ren, Dudi1; Hanus, Riley5; Qiu, Pengfei1; Iversen, Bo B.3; Xu, Fangfang1; Snyder, G. Jeffrey5; Shi, Xun1; Chen, Lidong1,6
2017
发表期刊Chemistry of Materials
ISSN08974756
卷号29期号:15页码:6367-6377
摘要Thermoelectric materials require an optimal carrier concentration to maximize electrical transport and thus thermoelectric performance. Element doping and composition off-stoichiometry are the two general and effective approaches for optimizing carrier concentrations, which have been successfully applied in almost all semiconductors. In this study, we propose a new strategy called bonding energy variation to tune the carrier concentrations in Cu2Se-based liquid-like thermoelectric compounds. By utilizing the different bond features in Cu2Se and Cu2S, alloying S at the Se sites successfully increases the bonding energy to fix Cu atoms in the crystal lattice to suppress the formation of Cu vacancies, leading to greatly reduced carrier concentrations toward the optimal value. Via a combination of the lowered electrical and lattice thermal conductivities and the relatively good carrier mobility caused by the weak alloy scattering potential, ultrahigh zT values are achieved in slightly S-doped Cu2Se with a maximal value of 2.0 at 1000 K, 30% higher than that in nominally stoichiometric Cu2Se. © 2017 American Chemical Society.
DOI10.1021/acs.chemmater.7b01687
EI入藏号20173304050003
EI主题词Copper alloys
EI分类号544.1 Copper - 544.2 Copper Alloys - 641.1 Thermodynamics - 701.1 Electricity: Basic Concepts and Phenomena - 712.1 Semiconducting Materials - 933.1.1 Crystal Lattice
引用统计
文献类型期刊论文
条目标识符http://ir.sic.ac.cn/handle/331005/25454
专题中国科学院上海硅酸盐研究所
作者单位1.State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai; 200050, China;
2.University of Chinese Academy of Sciences, Beijing; 100049, China;
3.Centre for Materials Crystallography, Department of Chemistry, INANO, Aarhus University, Langelandsgade 140, Aarhus C; DK-8000, Denmark;
4.Department of Materials Science and Engineering, NTNU Norwegian University of Science and Technology, Trondheim; NO-7491, Norway;
5.Department of Materials Science and Engineering, Northwestern University, Evanston; IL; 60208, United States;
6.Shanghai Institute of Materials Genome, Shanghai; 200444, China
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GB/T 7714
Zhao, Kunpeng,Blichfeld, Anders Bank,Chen, Hongyi,et al. Enhanced Thermoelectric Performance through Tuning Bonding Energy in Cu2Se1-xSxLiquid-like Materials[J]. Chemistry of Materials,2017,29(15):6367-6377.
APA Zhao, Kunpeng.,Blichfeld, Anders Bank.,Chen, Hongyi.,Song, Qingfeng.,Zhang, Tiansong.,...&Chen, Lidong.(2017).Enhanced Thermoelectric Performance through Tuning Bonding Energy in Cu2Se1-xSxLiquid-like Materials.Chemistry of Materials,29(15),6367-6377.
MLA Zhao, Kunpeng,et al."Enhanced Thermoelectric Performance through Tuning Bonding Energy in Cu2Se1-xSxLiquid-like Materials".Chemistry of Materials 29.15(2017):6367-6377.
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