SIC OpenIR
Enhanced Thermoelectric Performance through Tuning Bonding Energy in Cu2Se1-xSxLiquid-like Materials
Zhao, Kunpeng1,2; Blichfeld, Anders Bank3,4; Chen, Hongyi1,2; Song, Qingfeng1,2; Zhang, Tiansong1; Zhu, Chenxi1,2; Ren, Dudi1; Hanus, Riley5; Qiu, Pengfei1; Iversen, Bo B.3; Xu, Fangfang1; Snyder, G. Jeffrey5; Shi, Xun1; Chen, Lidong1,6
2017
Source PublicationChemistry of Materials
ISSN08974756
Volume29Issue:15Pages:6367-6377
AbstractThermoelectric materials require an optimal carrier concentration to maximize electrical transport and thus thermoelectric performance. Element doping and composition off-stoichiometry are the two general and effective approaches for optimizing carrier concentrations, which have been successfully applied in almost all semiconductors. In this study, we propose a new strategy called bonding energy variation to tune the carrier concentrations in Cu2Se-based liquid-like thermoelectric compounds. By utilizing the different bond features in Cu2Se and Cu2S, alloying S at the Se sites successfully increases the bonding energy to fix Cu atoms in the crystal lattice to suppress the formation of Cu vacancies, leading to greatly reduced carrier concentrations toward the optimal value. Via a combination of the lowered electrical and lattice thermal conductivities and the relatively good carrier mobility caused by the weak alloy scattering potential, ultrahigh zT values are achieved in slightly S-doped Cu2Se with a maximal value of 2.0 at 1000 K, 30% higher than that in nominally stoichiometric Cu2Se. © 2017 American Chemical Society.
DOI10.1021/acs.chemmater.7b01687
EI Accession Number20173304050003
EI KeywordsCopper alloys
EI Classification Number544.1 Copper - 544.2 Copper Alloys - 641.1 Thermodynamics - 701.1 Electricity: Basic Concepts and Phenomena - 712.1 Semiconducting Materials - 933.1.1 Crystal Lattice
Citation statistics
Cited Times:24[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/25454
Collection中国科学院上海硅酸盐研究所
Affiliation1.State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai; 200050, China;
2.University of Chinese Academy of Sciences, Beijing; 100049, China;
3.Centre for Materials Crystallography, Department of Chemistry, INANO, Aarhus University, Langelandsgade 140, Aarhus C; DK-8000, Denmark;
4.Department of Materials Science and Engineering, NTNU Norwegian University of Science and Technology, Trondheim; NO-7491, Norway;
5.Department of Materials Science and Engineering, Northwestern University, Evanston; IL; 60208, United States;
6.Shanghai Institute of Materials Genome, Shanghai; 200444, China
Recommended Citation
GB/T 7714
Zhao, Kunpeng,Blichfeld, Anders Bank,Chen, Hongyi,et al. Enhanced Thermoelectric Performance through Tuning Bonding Energy in Cu2Se1-xSxLiquid-like Materials[J]. Chemistry of Materials,2017,29(15):6367-6377.
APA Zhao, Kunpeng.,Blichfeld, Anders Bank.,Chen, Hongyi.,Song, Qingfeng.,Zhang, Tiansong.,...&Chen, Lidong.(2017).Enhanced Thermoelectric Performance through Tuning Bonding Energy in Cu2Se1-xSxLiquid-like Materials.Chemistry of Materials,29(15),6367-6377.
MLA Zhao, Kunpeng,et al."Enhanced Thermoelectric Performance through Tuning Bonding Energy in Cu2Se1-xSxLiquid-like Materials".Chemistry of Materials 29.15(2017):6367-6377.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Zhao, Kunpeng]'s Articles
[Blichfeld, Anders Bank]'s Articles
[Chen, Hongyi]'s Articles
Baidu academic
Similar articles in Baidu academic
[Zhao, Kunpeng]'s Articles
[Blichfeld, Anders Bank]'s Articles
[Chen, Hongyi]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Zhao, Kunpeng]'s Articles
[Blichfeld, Anders Bank]'s Articles
[Chen, Hongyi]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.