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Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles
Yang, Wanchun1; Wang, Shuai2; Zhu, Wenbo1; Wei, Jun1; Li, Mingyu1
2018
Source PublicationHanjie Xuebao/Transactions of the China Welding Institution
ISSN0253360X
Volume39Issue:6Pages:72-76
AbstractThe Cu nanoparticles (Cu NPs) solder paste was applied to connect high-power semiconductor devices at low temperature. The preparation method of the Cu NPs solder paste included the following steps: First, Cu NPs with an average particle size of 30 nm were synthesized by the modified polyol method. Then, the Cu NPs were dispersed in formic acid to remove the surface oxide of Cu NPs. After that, the Cu NPs were mixed with ethylene glycol to prepare solder paste with a solid content of 70%. The DBC ceramic substrate and the metallized SiC die was connected by sintering at low temperature from 160 to 320 for 5 min, and the assist pressure was 10 MPa. The morphology of the joint was investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The result showed that the connection joints with high shearing strength and conductivity were formed by metallurgical bonding between the sintered Cu NPs layer and Cu pad. Coarse microstructure was formed inside the sintered joint. © 2018, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
DOI10.12073/j.hjxb.2018390152
PublisherHarbin Research Institute of Welding
EI KeywordsCopper
EI Classification Number544.1 Copper - 641.1 Thermodynamics - 701.1 Electricity: Basic Concepts and Phenomena - 714.2 Semiconductor Devices and Integrated Circuits - 741.3 Optical Devices and Systems - 761 Nanotechnology - 804.1 Organic Compounds - 804.2 Inorganic Compounds - 933 Solid State Physics
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Document Type期刊论文
Identifierhttp://ir.sic.ac.cn/handle/331005/25307
Collection中国科学院上海硅酸盐研究所
Affiliation1.School of materials Science and Engineering, Harbin Institute of Technology, Shenzhen Graduate School, Shenzhen; 518055, China;
2.Shanghai institute of radio equipment, Shanghai; 200090, China
Recommended Citation
GB/T 7714
Yang, Wanchun,Wang, Shuai,Zhu, Wenbo,et al. Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles[J]. Hanjie Xuebao/Transactions of the China Welding Institution,2018,39(6):72-76.
APA Yang, Wanchun,Wang, Shuai,Zhu, Wenbo,Wei, Jun,&Li, Mingyu.(2018).Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles.Hanjie Xuebao/Transactions of the China Welding Institution,39(6),72-76.
MLA Yang, Wanchun,et al."Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles".Hanjie Xuebao/Transactions of the China Welding Institution 39.6(2018):72-76.
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